die attachment meaning in English

模片固定
小片连接
芯片焊接

The thesis focuses on the stress issue induced by die attachment in mems ( namely , micro - electronic - mechanical system ) packaging
本论文主要研究对mems封装中芯片粘贴于基板时所引起的应力问题。
Several kinds of arts and crafts of eutectic die attachment are compared , the different application scope is discussed , the specific factors of impact ic quality is analyzed , some simple discussions and summary to experiment results are given
本文对几种共晶烧结方法进行了实验比较，讨论了各种方法的适用范围，影响质量的因素并对实验结果进行了简单的讨论。